JPH0622995Y2 - 半導体素子の固定構造 - Google Patents

半導体素子の固定構造

Info

Publication number
JPH0622995Y2
JPH0622995Y2 JP10287989U JP10287989U JPH0622995Y2 JP H0622995 Y2 JPH0622995 Y2 JP H0622995Y2 JP 10287989 U JP10287989 U JP 10287989U JP 10287989 U JP10287989 U JP 10287989U JP H0622995 Y2 JPH0622995 Y2 JP H0622995Y2
Authority
JP
Japan
Prior art keywords
semiconductor element
metal fitting
heat dissipation
protrusion
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP10287989U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0341939U (en]
Inventor
光政 板垣
Original Assignee
富士通電装株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 富士通電装株式会社 filed Critical 富士通電装株式会社
Priority to JP10287989U priority Critical patent/JPH0622995Y2/ja
Publication of JPH0341939U publication Critical patent/JPH0341939U/ja
Application granted granted Critical
Publication of JPH0622995Y2 publication Critical patent/JPH0622995Y2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP10287989U 1989-09-01 1989-09-01 半導体素子の固定構造 Expired - Fee Related JPH0622995Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10287989U JPH0622995Y2 (ja) 1989-09-01 1989-09-01 半導体素子の固定構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10287989U JPH0622995Y2 (ja) 1989-09-01 1989-09-01 半導体素子の固定構造

Publications (2)

Publication Number Publication Date
JPH0341939U JPH0341939U (en]) 1991-04-22
JPH0622995Y2 true JPH0622995Y2 (ja) 1994-06-15

Family

ID=31651749

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10287989U Expired - Fee Related JPH0622995Y2 (ja) 1989-09-01 1989-09-01 半導体素子の固定構造

Country Status (1)

Country Link
JP (1) JPH0622995Y2 (en])

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7206204B2 (en) 2003-12-19 2007-04-17 Hitachi Industrial Equipment Systems Co., Ltd. Electric circuit module
JP2014203979A (ja) * 2013-04-05 2014-10-27 Tdk株式会社 電源装置

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4548517B2 (ja) * 2008-05-26 2010-09-22 株式会社豊田自動織機 発熱部品の実装構造及び実装方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7206204B2 (en) 2003-12-19 2007-04-17 Hitachi Industrial Equipment Systems Co., Ltd. Electric circuit module
JP2014203979A (ja) * 2013-04-05 2014-10-27 Tdk株式会社 電源装置

Also Published As

Publication number Publication date
JPH0341939U (en]) 1991-04-22

Similar Documents

Publication Publication Date Title
JP6898162B2 (ja) 電子部品の固定構造
JP2000502843A (ja) 少なくとも２つのハウジング部分から成る制御装置
JP4643703B2 (ja) 半導体装置の固定具及びその取付構造
JPS6390159A (ja) 集積回路接続装置
JPH0622995Y2 (ja) 半導体素子の固定構造
CN214487629U (zh) 服务器cpu散热器硅脂涂覆治具
CN210986811U (zh) 一种弹性光口散热器
JPH03268348A (ja) 表面実装型ｉｃパッケージの放熱構造
JPH0331092Y2 (en])
CN219780737U (zh) 散热装置
JP2011009370A (ja) 半導体装置の固定具及びその取付構造
JPH0810204Y2 (ja) 半導体部品取付構造
JP3050938U (ja) Ｃｐｕ放熱片の固定装置
JP3050723U (ja) 固定具を備えたヒートシンク
CN219832636U (zh) 一种晶体管安装装置
CN220510016U (zh) 一种晶闸管模块
JPS627145A (ja) 電力半導体装置
CN213988867U (zh) 红外模组
JPH051285U (ja) 放熱プレート
JP2003037225A (ja) 電子部品の冷却用熱伝導シート及び電子部品の冷却構造
JPH0316290Y2 (en])
JPH064635Y2 (ja) 放熱器の取付け構造
JPH0289352A (ja) 半導体装置
JPS6177349A (ja) 混成集積回路の冷却方法
CN120453769A (zh) 连接器

Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees